This report studies the global Solderless Breadboards market status and forecast, categorizes the global Solderless Breadboards market size (value & volume) by manufacturers, type, application, and region. This report focuses on the top manufacturers in North America, Europe, Japan, China, India, Southeast Asia and other regions (Central & South America, and Middle East & Africa).
This report studies the Solderless Breadboards market, a breadboard is a construction base for prototyping of electronics. Originally it was literally a bread board, a polished piece of wood used for slicing bread. In the 1970s the solderless breadboard (AKA plugboard, a terminal array board) became available and nowadays the term “breadboard” is commonly used to refer to these.
Because the solderless breadboard does not require soldering, it is reusable. This makes it easy to use for creating temporary prototypes and experimenting with circuit design. For this reason, solderless breadboards are also extremely popular with students and in technological education. Older breadboard types did not have this property.
First, as for the global Solderless Breadboards industry, the industry concentration rate (Volume) is highly dispersed. The top 5 manufacturers have 49.84% market share in 2016. The 3M which has 16.38% market share in 2016, is the leader in the Solderless Breadboards industry. The manufacturers following 3M are B&K Precision and MikroElektronika, which respectively has 12.01% and 8.17% market share globally.
Europe and North America are also growing in terms of demand due to high product applications in Education and R&D. Due to the technical requirements of the production process is not high, the industry’s OEM phenomenon is very prominent. Because obvious labor cost advantage in the Asia-Pacific region, a large number of products has been manufacturers by Chinese OEMs and exported to Europe and the United States.
The global Solderless Breadboards market is valued at xx million US$ in 2017 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2018-2025.
The major manufacturers covered in this report
CIXI WANJIE ELECTRONIC
Geographically, this report studies the top producers and consumers, focuses on product capacity, production, value, consumption, market share and growth opportunity in these key regions, covering
Other regions (Central & South America, Middle East & Africa)
On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into
Assembly (On Frame)
Terminal and Distribution Strips (No Frame)
Powered (On Frame)
By Application, the market can be split into
R & D
The study objectives of this report are:
To analyze and study the global Solderless Breadboards capacity, production, value, consumption, status (2013-2017) and forecast (2018-2025);
Focuses on the key Solderless Breadboards manufacturers, to study the capacity, production, value, market share and development plans in future.
Focuses on the global key manufacturers, to define, describe and analyze the market competition landscape, SWOT analysis.
To define, describe and forecast the market by type, application and region.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends and factors driving or inhibiting the market growth.
To analyze the opportunities in the market for stakeholders by identifying the high growth segments.
To strategically analyze each submarket with respect to individual growth trend and their contribution to the market.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.
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