Global 3D Time-of-flight Image Sensors market is valued at 620 million USD in 2017 and is expected to reach 3250 million USD by the end of 2025, growing at a CAGR of 23.0% between 2018 and 2025.

This report studies the global 3D Time-of-flight Image Sensors industry status, China market entry and growth opportunity, focuses on the Chinese local and International manufacturers, analyzes the China market competition landscape, market size (value and volume), opportunity and challenge, risk and entry barriers.3D time-of-flight (ToF) sensor is part of the 3D ToF image sensor family. The device combines ToF sensing with an optimally-designed analog-to-digital converter (ADC) and a versatile, programmable timing generator (TG).

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The built-in TG controls the reset, modulation, readout, and digitization sequence. The programmability of the TG offers flexibility to optimize for various depth-sensing performance.

On the basis of type, the 3D Time-of-flight Image Sensor market is segmented into Half-QQVGA ToF Image Sensor, QVGA ToF Image Sensor, and Others. The QVGA ToF Image Sensor segment is expected to account for the larger share of the global market in 2017.

End-users, included in this market are Consumer Electronics, Robotics and Drone, Machine Vision and Industrial Automation, Entertainment, Automobile, and Others usage. The Consumer Electronics application is expected to account for the largest share of the global market in 2017.

Based on regions, the global 3D Time-of-flight Image Sensor market is segmented into North America, Europe, China, Japan, Korea, Asia Other, and the Rest of the World (ROW). USA and Europe is expected to account for larger share and China is growing fastest of the market during the forecast period.

The global 3D Time-of-flight Image Sensors market is valued at 620 million USD in 2017 and is expected to reach 3250 million USD by the end of 2025, growing at a CAGR of 23.0% between 2018 and 2025.

This research report categorizes the China and global 3D Time-of-flight Image Sensors market by type, end-use industry, and region.

International Manufacturers Covered

Texas Instruments

STMicroelectronics

PMD Technologies

Infineon

PrimeSense (Apple)

MESA (Heptagon)

Melexis

ifm Electronic

Canesta (Microsoft)

Espros Photonics

TriDiCam

China Local Manufacturers Covered

By Type

Half-QQVGA ToF Image Sensor

QVGA ToF Image Sensor

Others

By Application

Consumer Electronics

Robotics and Drone

Machine Vision and Industrial Automation

Entertainment

Automobile

Others

By Region

United States

Europe

Japan

Korea

Taiwan

The study objectives of this report are:

To analyze and study the ways and market feasibility to enter China market, for the international manufacturers manufacturing or selling products in China.

To study and forecast the market size (volume and value) of 3D Time-of-flight Image Sensors in China and global market.

Focuses on the China local manufacturers, to define, describe and analyze the market competition landscape, SWOT analysis, value and China market share for top local manufacturers.

To analyze the international manufacturers, SWOT analysis, volume, value and global market share for top manufacturers.

To define, describe and forecast the market by type, application and region.

To analyze and compare the market status and forecast between China and major regions, namely, United States, Europe, China, Japan and other Regions like Korea, Taiwan, India, Southeast Asia etc.

To analyze the China market potential and advantage, opportunity and challenge, restraints and risks.

To identify significant trends and factors driving or inhibiting the market growth.

To analyze the opportunities in the market for stakeholders by identifying the high growth segments.

To strategically analyze each submarket with respect to individual growth trend and their contribution to the market.

To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

To strategically profile the key players and comprehensively analyze their growth strategies.

In this study, the years considered to estimate the market size of 3D Time-of-flight Image Sensors are as follows:

History Year: 2013-2017

Base Year: 2017

Estimated Year: 2018

Forecast Year 2018 to 2025

For the data information by region, company, type and application, 2017 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

Available Customizations

With the given market data, QYResearch offers customizations according to the company’s specific needs. The following customization options are available for the report:

Regional and country-level analysis of the 3D Time-of-flight Image Sensors market, by end-use.

Detailed analysis and profiles of additional market players.

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