Global Die Bonder Equipment market is expected to reach $779.89 million by 2022 from $759.63 million in 2017, growing at a CAGR of 0.53% from 2017 to 2022. And Europe market is expected to be the biggest market with output market share of 30.84% in 2022.

The global Die Bonder Equipment market is expected to reach $779.89 million by 2022 from $759.63 million in 2017, growing at a CAGR of 0.53% from 2017 to 2022. And Europe market is expected to be the biggest market with output market share of 30.84% in 2022.

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The industry is concentration, the key brand include Besi, ASM Pacific Technology(ASMPT), Kulicke & Soffa, Palomar Technologies, Shinkawa, DIAS Automation, Toray Engineering, Panasonic, FASFORD TECHNOLOGY, West-Bond, Hybond

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Die Bonder Equipment industry is highly concentrated, manufacturers are mostly in the Asia, Europe and US. Among them, Europe output volume accounted for more than 32.09% of the total output of global Die Bonder Equipment in 2016. Besi is the world leading manufacturer in global Die Bonder Equipment market with the market share of 39.21%, in terms of revenue.

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There are major three classifications of Die Bonder Equipment in this report, Fully Automatic, Semi-Automatic and Manual. In the global market, the output volume share of each type of Die Bonder Equipment is 67.87%, 16.87% and 15.26% in 2016.

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The report then focuses on major industry players in Global, including company profiles, product images and specifications, sales, market share, and contact information. More importantly, the Die Bonder Equipment industry development trends and marketing channels were analyzed. Providing the main statistical data on the current status of the industry is a valuable guide and direction for companies and individuals interested in the market.

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