Global Electrostatic Chucks for Wafer Market is projected to exhibit a CAGR of 5.52% between 2017 and 2025

According to the report, global revenue for Electrostatic Chucks for Wafer was valued at $ 244.37 million in 2017, and is expected to generate revenue of $ 375.56 million by end of 2025, growing at a CAGR of slightly above 5.52% between 2017 and 2025.
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The Electrostatic Chucks (ESC) is a tool that clamps an object with the force generated between the electrode and the object by applying a voltage to the electrode. There are two different types of electrostatic clamping methods. One is Coulomb force type that utilizes an insulator as a dielectric material, and the other is Johnson-Rahbek force type that utilizes an attractive force induced by dielectric polarization caused by minute electric current flow across the boundary between an object and a dielectric material. ESCs which are widely used for wafer processing including etching, CVD, PVD, Ashing etc.

Global Electrostatic Chucks for Wafer Market is projected to exhibit a CAGR of 5.52% between 2017 and 2025

Key vendors analysed in this market research are

·       SHINKO

·       TOTO

·       Creative Technology Corporation

·       Kyocera

·       FM Industries

·       NTK CERATEC

·       Tsukuba Seiko

·       Applied Materials

·       II-VI M Cubed

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Of the major players of Electrostatic Chucks for Wafer, SHINKO maintained its first place in the ranking in 2017. SHINKO accounted for 43.83% of the Global Electrostatic Chucks for Wafer production valuemarket share in 2017. Top 3 players in this market include SHINKO, TOTO and Creative Technology Corporation.

China held the largest share of the Electrostatic Chucks for Wafer market in 2017, which accounted for 54.66% production volume market share in 017.

On the basis of product type, the Coulomb Type Electrostatic Chucks segment is projected to account for the largest Revenue market share during the forecast period; this segment is estimated to account for 71.86 % Revenue market share by the end of 2025.

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