This report studies the global HTCC Ceramic Substrates market status and forecast, categorizes the global HTCC Ceramic Substrates market size (value & volume) by manufacturers, type, application, and region. This report focuses on the top manufacturers in North America, Europe, Japan, China, India, Southeast Asia and other regions (Central & South America, and Middle East & Africa).
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Co-fired ceramic devices are monolithic, ceramic microelectronic devices where the entire ceramic support structure and any conductive, resistive, and dielectric materials are fired in a kiln at the same time. Typical devices include capacitors, inductors, resistors, transformers, and hybrid circuits. The technology is also used for a multi-layer packaging for the electronics industry, such as military electronics, MEMS, microprocessor and RF applications.
High temperature Ceramic Substrates means that the sintering temperature is around 1,600 °C (2,910 °F).
In the short term, Japan, United States and Europe will have an unshakable status in HTCC ceramic substrates; China will play an more important role in future, driven by the strong demand from consumer electronics, aerospace & military, automobile electronics and LED market.
The global HTCC Ceramic Substrates market is valued at 110 million US$ in 2017 and will reach 130 million US$ by the end of 2025, growing at a CAGR of 2.3% during 2018-2025.
The major manufacturers covered in this report
NGK Spark Plug
SCHOTT Electronic Packaging
Semiconductor Enclosures Inc(SEI)
Geographically, this report studies the top producers and consumers, focuses on product capacity, production, value, consumption, market share and growth opportunity in these key regions, covering
Other regions (Central & South America, Middle East & Africa)
We can also provide the customized separate regional or country-level reports, for the following regions:
Rest of Asia-Pacific
Rest of Europe
Central & South America
Rest of South America
Middle East & Africa
Rest of Middle East & Africa
On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into
Al2O3 HTCC Substrate
AIN HTCC Substrate
By Application, the market can be split into
Aerospace & Military
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