Global Thermo Compression Bonder market is valued at 33 million US$ in 2017 and will reach 150 million US$ by the end of 2025, growing at a CAGR of 21.0% during 2018-2025 – QY Research

This report studies the global Thermo Compression Bonder market status and forecast, categorizes the global Thermo Compression Bonder market size (value & volume) by manufacturers, type, application, and region. This report focuses on the top manufacturers in North America, Europe, Japan, China, India, Southeast Asia and other regions (Central & South America, and Middle East & Africa).

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Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the die in a process called “Thermo Compression Bonding”. The bumps are forced against their opposing pads and a second metallic bond is formed where the bond comes into contact with the package metallization. This technique typically requires the use of heat as high as 350° to 400°C, and forces of as much as 100 g/bump.

Thermo Compression Bonding (TCB) is a chip attach technology under investigation and implementation in multiple platforms. The global Thermo Compression Bonder market is driven by increased Thermo Compression Bonder usage: memory applications currently, logic devices next. Meanwhile, Thermo Compression Bonder is gaining market share from wire bond assembly processes. Also, lower throughput coupled with higher processing costs was example of challenges in the TCB technology.

China Thermo Compression Bonder market is valued at $6.39 million in 2017 and is expected to reach $19.53 million by the end of 2023, growing at a CAGR of 20.47% between 2018 and 2023.

The global Thermo Compression Bonder market is valued at 33 million US$ in 2017 and will reach 150 million US$ by the end of 2025, growing at a CAGR of 21.0% during 2018-2025.

The major manufacturers covered in this report

ASMPT (AMICRA)

K&S

Besi

Shibaura

SET

Hanmi

Geographically, this report studies the top producers and consumers, focuses on product capacity, production, value, consumption, market share and growth opportunity in these key regions, covering

North America

Europe

China

Japan

India

Southeast Asia

Other regions (Central & South America, Middle East & Africa)

We can also provide the customized separate regional or country-level reports, for the following regions:

North America

United States

Canada

Mexico

Asia-Pacific

China

India

Japan

South Korea

Australia

Indonesia

Singapore

Rest of Asia-Pacific

Europe

Germany

France

UK

Italy

Spain

Russia

Rest of Europe

Central & South America

Brazil

Argentina

Rest of South America

Middle East & Africa

Saudi Arabia

Turkey

Rest of Middle East & Africa

On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into

Automatic Thermo Compression Bonder

Manual Thermo Compression Bonder

By Application, the market can be split into

IDMs

OSAT

Click to view the full report TOC, figure and tables

https://www.qyresearch.com/index/detail/561524/global-thermo-compression-bonder-market

 

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